投稿資訊 | The 37th VLSI Design/CAD Symposium 第37屆超大型積體電路設計暨計算機輔助設計技術研討會

大會徵稿

徵稿期間：
投稿系統開放日~ 2026 年 5 月 12 日止
論文錄取通知日：2026 年 6 月 18 日

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*獲選 Best Papers 將推薦至 IJEE Special Issue

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Requirements

2-4 pages
IEEE 2-column format
PDF format only
Original work
Author attendance

Analog & RF

Subcomm. 1: Analog Circuits and Systems (ACS)

Analog Circuits and Sensor Interfaces
Medical Devices and Biomedical Systems
Imagers and Display Drivers

Subcomm. 2: Data Converters (DC)

Nyquist-Rate and Oversampling A/D and D/A Converters
Embedded and Application-Specific A/D and D/A Converters
Sub-Circuits for Data Converters, Including Sample-and-Hold Circuits, Calibration Circuits, etc.

Subcomm. 3: Power Management and Energy Systems (PMES)

Power Electronic Circuits and Systems
Power Converters
Energy Harvesting Circuits
Wireless Power Transfer Circuits and Systems

Subcomm. 4: RF, Wireless, and Wireline (RWW)

Wireline (Optical/Electrical) Transceiver Systems and Circuits
Wireless Transceiver Systems and Circuits

Digital & System

Subcomm. 5: Digital Circuits and Systems (DCS)

Low-Power Logic, Arithmetic Circuits, and Hardware Security
Multi-Core Systems, Network-on-Chip, and Embedded SoC Systems
Baseband Signal Processing ICs, Communication & AIoT Systems
B5G and Satellite Communications

Subcomm. 6: AI and Memory Systems (AIM)

Artificial Intelligence Circuits and Systems, Neuromorphic Hardware
Memory Hardware Circuits and GPU/NPU Systems

Subcomm. 7: Signal Processing and Healthcare (SPH)

Digital Signal Processing ICs, Image/Visual & Multimedia Systems
Biomedical, Bioinformatics, Biometrics, and Healthcare Systems

EDA & Testing

Subcomm. 8: Testing and Verification (TV)

Fault Model/Simulation, DFT and ATPG
Mixed-Signal/RF/Memory/MEMS Tests
Chiplet, 2.5D and 3D IC Tests
Design and Test for Reliability, Safety and Security
AI-based Tests and Testing for AI Systems
Design Validation, Verification and Debug
Test for Emerging Technologies

Subcomm. 9: Electronic Design Automation for Advanced Technologies and Heterogeneous Integration (EDA-ATHI)

AI-Driven Design Automation Across System, Logic, and Physical Levels
Physical-Level Design Automation Including Placement, Routing, Optimization, and Physical Verification
Timing/Power/Thermal Modeling/Analysis/Optimization and DFM

Emerging Technologies

Subcomm. 10: Emerging Technologies and Applications (ETA)

Automotive Electronics and Systems
Edge and Cloud Computing
Lab-on-a-Chip
Quantum Computing Circuits and Systems
Others